品牌:
Broadcom (博通)(29)
Microsemi (美高森美)(12)
NXP (恩智浦)(14)
Huntersun(1)
Diodes (美台)(1)
Qorvo(21)
Skyworks Solutions(17)
Microchip (微芯)(5)
Infineon (英飞凌)(4)
Hittite(134)
ADI (亚德诺)(23)
AVAGO Technologies (安华高科)(1)
Tallysman Wireless(1)
California Eastern Laboratories(4)
Maxim Integrated (美信)(9)
NEC (日本电气)(2)
M/A-Com(6)
Motorola (摩托罗拉)(1)
TriQuint(3)
Panasonic (松下)(1)
HITACHI (日立)(1)
NJR (新日本无线)(1)
Renesas Electronics (瑞萨电子)(1)
RFMD (威讯)(2)
ST Microelectronics (意法半导体)(1)
多选
封装:
(76)
HTSSOP(1)
LGA(1)
TSSOP-6(3)
DIE(12)
QFN-16(5)
SOT-89(2)
DIE (2.641 mm x 1.48 mm) / Wafer(1)
SOT-363(5)
-(18)
SMD-10(3)
SMD-14(6)
LSSOP-20(1)
VFQFN-24(14)
SOT-1855(1)
SOT1464(1)
TFQFN-32(2)
SOT-23-6(2)
MSOP-8(4)
TFQFN-24(12)
VFQFN-16(16)
TSSOP-8(6)
SOT-89-4(1)
QSOP-16(1)
TO-243(6)
VFQFN-32(10)
TFQFN-16(1)
VFQFN-12(4)
SMD-42(6)
SOT-89-3(5)
SOIC-16(4)
SMA(2)
8 Lead Glass Package(1)
SOT-23(1)
SOT-363-6(3)
211-07(1)
QFN-32(4)
2414(1)
TSSOP-16(1)
SMD-9(1)
TQFN-48(1)
WLCSP(1)
SO-8(1)
SOT-343-4(1)
QFN(3)
pad-10(2)
QFN-24(3)
SOT1436(1)
SC-70-6(2)
SMD-8(1)
VQFN-28(1)
SOP(1)
LFQFN-32(2)
CHIP(1)
QFN-12(1)
VFCQFN-12(1)
TQFN-16(1)
SOT-86(3)
VQFN-16(2)
VQFN-32(2)
VFDFN-6(2)
QFN-40(1)
TFCQFN-24(1)
VFQFN-20(1)
DFN-6(1)
TDFN-6(1)
VDFN-6(1)
WFDFN-6(1)
1.49 mm x 0.85 mm x 0.085 mm(1)
TSSOP(1)
QFN-28(1)
UFQFN-20(1)
Style(1)
VFQFN-64(1)
TO-272-16(1)
SC-88(1)
QFN-80(1)
WDFN-6(1)
多选
包装:
(295)
型号/品牌/封装
品类/描述
库存
价格(含税)
资料

©Copyright 2013-2025 亿配芯城(深圳)电子科技有限公司 粤ICP备17008354号

Scroll

对比栏

展开

对比

清空